An overview of carbon nanotubes based interconnects for microelectronic packaging
Paper i proceeding, 2017

Owing to the great demand in more functions and miniaturization in microelectronic packaging, the dimensions of interconnects has decreased extremely, which has resulted in electrical, thermal, and mechanical reliability issues. To address these issues, carbon nanotube (CNT) has been selected as a promising alternative material for the interconnects in packaging due to its large current density, high thermal conductivity, great flexibility, and low coefficient of thermal expansion (CTE). In this paper, the development of CNTs based vertical interconnects was reviewed. However, the resistivity of CNTs based interconnects was much higher than that of copper interconnects. Thus, this review focused on the resistivity of CNTs-based interconnects in different fabrication process and pointed out what improves the resistivity. In the future, CNTs-Cu nanocomposite with unique properties could be the suitable material for bumps to reduce the resistivity of CNTs based bumps further.

Interconnect

CNTs-Cu nanocomposite

CNTs based TSVs

CNTs based bumps

resistivity

Författare

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Shanghai University

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Shanghai University

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Shanghai University

[Person 2c8c35d8-3094-4048-84c8-96d4973d943c not found]

Shanghai University

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Shanghai University

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Shanghai University

[Person f1d731e8-2bb0-4572-bf55-d3650e6d30a1 not found]

Shanghai University

[Person 9c7bdf8f-1c6d-4d29-8241-794690ca6a0b not found]

Shanghai University

[Person a395703d-7cb8-4209-bb75-5429eca3e994 not found]

[Person becce727-9c07-4285-8487-ae55b6538016 not found]

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017

113-119

Ämneskategorier

Kompositmaterial och -teknik

DOI

10.1109/NORDPAC.2017.7993175

ISBN

978-1-5386-3055-6

Mer information

Senast uppdaterat

2018-09-21