An overview of carbon nanotubes based interconnects for microelectronic packaging
Paper in proceedings, 2017

Owing to the great demand in more functions and miniaturization in microelectronic packaging, the dimensions of interconnects has decreased extremely, which has resulted in electrical, thermal, and mechanical reliability issues. To address these issues, carbon nanotube (CNT) has been selected as a promising alternative material for the interconnects in packaging due to its large current density, high thermal conductivity, great flexibility, and low coefficient of thermal expansion (CTE). In this paper, the development of CNTs based vertical interconnects was reviewed. However, the resistivity of CNTs based interconnects was much higher than that of copper interconnects. Thus, this review focused on the resistivity of CNTs-based interconnects in different fabrication process and pointed out what improves the resistivity. In the future, CNTs-Cu nanocomposite with unique properties could be the suitable material for bumps to reduce the resistivity of CNTs based bumps further.


CNTs-Cu nanocomposite

CNTs based TSVs

CNTs based bumps



S. Chen

Shanghai University

B. Shan

Shanghai University

Y. Yang

Shanghai University

G. Yuan

Shanghai University

S. Huang

Shanghai University

X. Lu

Shanghai University

Y. Zhang

Shanghai University

Yifeng Fu

Shanghai University

L. Ye

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017


Subject Categories

Composite Science and Engineering





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