Improved reliability of electrically conductive adhesives joints on Cu-Plated PCB substrate enhanced by graphene protection barrier
Paper i proceeding, 2017
Cu-Plated PCB
Graphene protection barrier
Reliability
Författare
S. Huang
Shanghai University
W. Ke
Shanghai University
Y. Yang
Shanghai University
H. Ye
Shanghai University
S. Chen
Shanghai University
B. Shan
Shanghai University
Jie Bao
Huangshan University
Q. Wang
Shenzhen Institute of Advanced Graphene Application and Technology (SIAGAT)
G. Yuan
Shanghai University
X. Lu
Shanghai University
Y. Zhang
Shanghai University
Yifeng Fu
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
L. Ye
SHT Smart High-Tech
Johan Liu
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017
143-146
978-1-5386-3055-6 (ISBN)
Ämneskategorier
Polymerteknologi
DOI
10.1109/NORDPAC.2017.7993181
ISBN
978-1-5386-3055-6