Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials
Paper i proceeding, 2018

Following Moores law, the development of electronics has led to an exponential increase of transistor density over the last couple of decades. Unfortunately, this trend also gives an increased heat power density in active components. Thermal interface materials (TIMs) are used to decrease the thermal resistance in thermal packages by filling out air gaps that naturally form there. TIMs are at the same time identified as a bottleneck due to their relatively low thermal conductivity. Carbon nanotubes (CNTs) are proposed as a future material for TIMs due to their high thermal conductivity and conformable nature. However, no reliability studies for CNT array TIMs can be found in literature that would demonstrate how these types of interfaces would perform. This is to the authors best knowledge the first reported study on thermal reliability for a CNT array TIM, which will be an important step towards a market realisation.

Författare

Andreas Nylander

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Christian Chandra Darmawan

SHT Smart High-Tech

Ana Borta Boyon

Thales Res & Technol France

Laurent Divay

Thales Res & Technol France

Majid Kabiri Samani

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Mohamad Abo Ras

Berliner Nanotest & Design GmbH

Julien Fortel

Thales DMS France

Yifeng Fu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Lilei Ye

SHT Smart High-Tech

Afshin Ziaei

Thales Res & Technol France

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

2018 24TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC)

2474-1515 (ISSN) 2474-1523 (eISSN)

24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Stockholm, ,

Ämneskategorier

Textil-, gummi- och polymermaterial

Materialkemi

Kompositmaterial och -teknik

DOI

10.1109/THERMINIC.2018.8593282

Mer information

Senast uppdaterat

2019-08-06