Development of a test platform for thermal characterization using through-silicon-via technology
Paper in proceedings, 2009
Through-Silicon-Via
Thermal characterization
Micromaching
Test platform
Author
Yifeng Fu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Teng Wang
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
IMAPS Nordic Annual Conference 2009; Tonsberg; Norway; 13 September 2009 through 15 September 2009
35-38
Subject Categories
Industrial Biotechnology
ISBN
978-162276183-8