Xingrui Chen

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Enhancing the mechanical reliability of miniaturized thermoelectric cooler using nanotechnology underfill

Xingrui Chen, Teng Wang, Joachim Nurnus et al
Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010 (Article number 5582779), p. 1250-1254
Paper in proceedings

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