A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array
Paper in proceedings, 2007

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Yan Zhang

Chalmers, Applied Mechanics, Material and Computational Mechanics

Teng Wang

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/6/2017