A Study of CFD Simulation for On-chip Cooling with 2D CNT Micro-fin Array
Paper in proceeding, 2007
Author
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Yan Zhang
Chalmers, Applied Mechanics, Material and Computational Mechanics
Teng Wang
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering