Use of carbon nanotubes in potential electronics packaging applications
Conference contribution, 2010

Packaging of electronics is an important technology to interconnect, power, cool and protect the components in highly integrated systems. Continuous size shrinking and function integration of future electronics are expected to be driven mainly by the advances in packaging technology. Carbon nanotubes (CNTs) are proposed for many novel packaging solutions thanks to their unique electrical, thermal, and mechanical properties. This paper introduces potential use of CNTs in electronics packaging, in both interconnection and thermal management applications. The challenges of fully exploiting the great potential of CNTs in this field are also discussed.

Author

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Teng Wang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Yifeng Fu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

L. Ye

SHT Smart High-Tech

2010 10th IEEE Conference on Nanotechnology, NANO 2010

160-166

Subject Categories

Physical Sciences

DOI

10.1109/NANO.2010.5698052

ISBN

978-142447033-4

More information

Latest update

3/7/2018 7