Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg
Paper in proceedings, 2009

Author

Yifeng Fu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Teng Wang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the Annual Nordic Conference

35-38

Subject Categories

Materials Engineering

More information

Created

10/7/2017