Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg
Paper in proceeding, 2009

Author

Yifeng Fu

Chalmers, Applied Physics, Electronics Material and Systems

Other publications Research

Teng Wang

Chalmers, Applied Physics, Electronics Material and Systems

Other publications Research

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Other publications Research

Proceedings of the Annual Nordic Conference

35-38

Subject Categories

Materials Engineering

More information

Created

10/7/2017

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