Development of a test platform for thermal characterisation using a Through-Hole Via Technoloyg
Paper in proceedings, 2009
Author
Yifeng Fu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Teng Wang
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Proceedings of the Annual Nordic Conference
35-38
Subject Categories
Materials Engineering