Carbon-Nanotube Through-Silicon Via Interconnects for Three-Dimensional Integration
Journal article, 2011
Author
Teng Wang
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Kjell Jeppson
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
L. Ye
SHT Smart High-Tech
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
Small
1613-6810 (ISSN) 1613-6829 (eISSN)
Vol. 7 16 2313-2317Areas of Advance
Production
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1002/smll.201100615