Recent Progress of Carbon Nanotubes as Cooling Fins in Electronic Packaging
Paper in proceeding, 2008
Author
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Yifeng Fu
Chalmers, Applied Physics, Electronics Material and Systems
Teng Wang
Chalmers, Applied Physics, Electronics Material and Systems
Proceedings of the 2008 International Conference on Electronics Packaging Technology & High Density Packaging
E3-01
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering