Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection
Paper in proceeding, 2006
Author
Teng Wang
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany
Subject Categories
Other Materials Engineering