Development of Carbon Nanotube Bumps for Ultra Fine Pitch Flip Chip Interconnection
Paper in proceedings, 2006

Author

Teng Wang

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006), September 5-7, 2006, Dresden, Germany

Subject Categories

Other Materials Engineering

More information

Created

10/7/2017