Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material
Paper in proceeding, 2007
Author
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Björn Carlberg
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering