Investigation of Dielectric Strength of Electrospun Nanofiber Based Thermal Interface Material
Paper in proceedings, 2007

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Björn Carlberg

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017