PBGA Interconnect Behavior under Thermal Effects
Paper in proceedings, 2007

Author

Yan Zhang

Chalmers, Applied Mechanics, Material and Computational Mechanics

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Ragnar Larsson

Chalmers, Applied Mechanics, Material and Computational Mechanics

Proceedings of International Conference on Electronics Packaging (ICEP2007), Tokyo, Japan

329-334

Subject Categories

Applied Mechanics

More information

Created

10/7/2017