Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection
Paper in proceedings, 2006

Author

Yan Zhang

Chalmers, Applied Mechanics, Material and Computational Mechanics

Ragnar Larsson

Chalmers, Applied Mechanics, Material and Computational Mechanics

Jing-yu Fan

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proc. 1 st Electronics Systemintegration Technology Conference, 2006 (ESTC 2006), 5 - 7 Sept. 2006, Dresden, Germany

Vol. 2 757-761

Subject Categories

Applied Mechanics

ISBN

1-4244-0553-x

More information

Created

10/7/2017