Study on the Multi-Scale Properties of the Internal Structure in ACA Interconnection
Paper in proceeding, 2006
Author
Yan Zhang
Chalmers, Applied Mechanics, Material and Computational Mechanics
Ragnar Larsson
Chalmers, Applied Mechanics, Material and Computational Mechanics
Jing-yu Fan
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proc. 1 st Electronics Systemintegration Technology Conference, 2006 (ESTC 2006), 5 - 7 Sept. 2006, Dresden, Germany
Vol. 2 757-761
1-4244-0553-x (ISBN)
Subject Categories
Applied Mechanics
ISBN
1-4244-0553-x