Interface Modelling of an ACA Interconnect Using Micropolar Theory and Discontinuous Approximation
Paper in proceeding, 2005
Author
Yan Zhang
Chalmers, Applied Mechanics, Material and Computational Mechanics
Ragnar Larsson
Chalmers, Applied Mechanics, Material and Computational Mechanics
Jingyu Fan
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05)
pp115-119
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering