Micropolar Cohesive Zone Model for Delamination Failure in Microsystem Interconnects
Paper in proceedings, 2008

Author

Yan Zhang

Chalmers, Applied Mechanics, Material and Computational Mechanics

Ragnar Larsson

Chalmers, Applied Mechanics, Material and Computational Mechanics

Jing-yu Fan

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the 22nd International Congress of Theoretical and Applied Mechanics

Subject Categories

Applied Mechanics

ISBN

978-0-9805142-0-9

More information

Created

10/7/2017