Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection
Journal article, 2008

A conductive adhesive is a promising interconnection material for microsystem packaging. The interconnect features are of great importance to system responses under various loading conditions. The flip-chip packaging system with anisotropic conductive film (ACF) joint under thermal loadings has been investigated both experimentally and theoretically. The displacement distributions have been measured by an interferometer, which could provide the in-plane whole-field deformation observation. The interconnection is of much smaller scales compared with the neighbouring components such as the chip and substrate, and there are even finer internal structures involved in the joint. The wide scale range makes both experimental observation and conventional simulation difficult. A micropolar model is thus developed. Utilizing the homogenization, this model requires low computation resource. Combination of this model with a second-order model was able to produce a highly efficient and valid prediction of the packaging system response under thermal and mechanical loadings. Comparison of the micropolar model simulation and experimental data shows good agreement.

Author

Yan Zhang

Chalmers, Applied Mechanics, Material and Computational Mechanics

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Ragnar Larsson

Chalmers, Applied Mechanics, Material and Computational Mechanics

Itsuo Watanabe

Hitachi Chemical Company, Ltd.

Journal of Adhesion Science and Technology

0169-4243 (ISSN) 1568-5616 (eISSN)

Vol. 22 14 1717-1731

Subject Categories

Applied Mechanics

DOI

10.1163/156856108X320555

More information

Created

10/7/2017