Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling
Paper in proceeding, 2005
Author
Yan Zhang
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Jingyu Fan
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05)
pp360-364
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering