Numerical Simulation Based on CFD for Impingement Heat Transfer in Electronics Cooling
Paper in proceedings, 2005

Author

Yan Zhang

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Jingyu Fan

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05)

pp360-364

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017