Encapsulation of OLED device by Using Anisotropic Conductive Adhesive
Paper in proceeding, 2007
Author
Yan Zhang
Chalmers, Applied Mechanics, Material and Computational Mechanics
Måns Andreasson
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Hua Zhou
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Thorvald Andersson
Chalmers, Microtechnology and Nanoscience (MC2), Microwave Electronics
Jing-yu Fan
Proceedings of 2007 International Symposium on High Density Packaging and Microsystem Integration
314-317
1-4244-1252-8 (ISBN)
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering
ISBN
1-4244-1252-8