Characterization of thermally conductive epoxy nano-composites
Paper i proceeding, 2005

This work aims to develop an Anisotropic Conductive Adhesive (ACA) paste with improved thermal conductivity. ACA consists of a polymer based resin and conductive filler particles. We introduce an electrically insulating but thermally conductive phase into the adhesive. Nano and micro scale particles of alumina oxide, silicon carbide and carbon nanotubes are used with and without surface treatment. The thermal measurements are carried out by transient hot wire method. So far, the thermal conductivity of the epoxy has been increased with more than 100%.

transient hot wire

thermal conductivity

composites

Författare

Lisa Ekstrand

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fasta tillståndets elektronik

Helge Kristiansen

Conpart AS

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fasta tillståndets elektronik

28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005; Wiener Neustadt; Austria; 19 May 2005 through 20 May 2005

35-39

Ämneskategorier

Elektroteknik och elektronik

DOI

10.1109/ISSE.2005.1490994

ISBN

978-078039324-0