Characterization of thermally conductive epoxy nano-composites
Paper in proceeding, 2005
This work aims to develop an Anisotropic Conductive Adhesive (ACA) paste with improved thermal conductivity. ACA consists of a polymer based resin and conductive filler particles. We introduce an electrically insulating but thermally conductive phase into the adhesive. Nano and micro scale particles of alumina oxide, silicon carbide and carbon nanotubes are used with and without surface treatment. The thermal measurements are carried out by transient hot wire method. So far, the thermal conductivity of the epoxy has been increased with more than 100%.
transient hot wire
thermal conductivity
composites
Author
Lisa Ekstrand
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Helge Kristiansen
Conpart AS
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005; Wiener Neustadt; Austria; 19 May 2005 through 20 May 2005
Vol. 2005 35-39
978-078039324-0 (ISBN)
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/ISSE.2005.1490994
ISBN
978-078039324-0