Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application
Paper i proceeding, 2008

Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested in recent years. In this experiment study, the carbon nanotube (CNT) nano-particles were added into the polymer solution before the electrospinning to improve the thermal conductivity of nano-TIM. The polymer solution of Polyurethane was used for present electrospinning. The effects of a number of process parameters in the electrospinning were studied in this work. Different variables such as the distance between needle tip and collector, the voltage applied, and CNT nano-particles content were studied. The Scanning Electron Microscopy (SEM) was used to characterize nano-TIMs with CNT nano-particles.


Li Xu

Shanghai University

Cong Yue

Shanghai University

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial

Yan Zhang

Shanghai University

Xiuzhen Lu

Shanghai University

Zhaonian Cheng


2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008; Pudong, Shanghai; China; 28 July 2008 through 31 July 2008

978-142442740-6 (ISBN)


Elektroteknik och elektronik





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