Highly Thermal Conductive and Light -weight Craphene-based Heatsink
Paper i proceeding, 2019

With the developing trend ofminiaturization and integration of modem electronic devices, commercial hearsinks ivaterigh, like copper and ii iv are facing mare and mare challenges, such as inefficient cooling performance, large size turd heavy weight. Here, we salve the probletn by developing a novel highly thermal conductive and 11Mo-weight graphene heatsink. Cornposed by vertically-aligned and continUOUS graphene structures, heat transport was highly efficiero from the base 1o fin Ii: ininside the heatsink, The maximum through-platre thermal catuluctivity ofgraphene heatsink can be up to 1000 1500 Ward( which is over 7 times higher than aluminum, and even outperforms copper about 4 times_ Gmphene heatsink demonstrated outstanding cooling perffrmance which wm superior to copper heatsink with the same dimension and same power input. Noticeably, the graphene hearsink also has anportant advantagas of light-weight and high emissions,. The measured density (1 1 g cmli is only onroeighth of copper and lam than hoor of aluminum and emissivity is about ten times hiher than pure rapper and aluminum. The resulting graphene heatsink thus opertS rim opportunities for addressing large heat dissMatMn issues in weight' driven electronics and othm high power smions.

heatsink

graphene

cooling

thermal conductivity

Författare

Nan Wang

SHT Smart High-Tech

Ya Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Lilei Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)

2165-2341 (ISSN)

22nd European Microelectronics and Packaging Conference and Exhibition (EMPC)
Pisa, Italy,

Ämneskategorier

Energiteknik

Annan fysik

Annan elektroteknik och elektronik

DOI

10.23919/EMPC44848.2019.8951839

Mer information

Senast uppdaterat

2020-07-30