The effect of modulus on the performance of thermal conductive adhesives
Paper i proceeding, 2010

By analyzing the effect of modulus of epoxy and modulus of filler particles on the thermal conductivity of thermal conductive adhesives (TCA), this paper concludes, in contrast to intuition, that the stiffer epoxy will generate a larger contact area, and the "soft" epoxy with modulus of 0.5GPa will create the largest contact area, hence the highest thermal conductivity. Therefore, it is advisable to adopt softer epoxy in TCA. On the other hand, this paper finds that if the shrinkage of epoxy is low, i.e. 1% linear shrinkage, fillers composed of a mixture of Ag flakes and certain high stiffness material will cause a higher thermal conductivity, i.e. 7% larger than that of pure Ag fillers. This suggests that with low shrinkage epoxy, it is advisable to mix Ag flakes with high stiffness particles, e.g. Diamond or SiC. However, when linear shrinkage of epoxy is high, i.e. 3%, the highest thermal conductivity is achieved by using pure Ag fillers. Therefore, in such cases it is not advisable to use Bi-model. © 2010 IEEE.

Författare

Zhili Hu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Cong Yue

SMIT Ltd. Co.

Shanghai University

X. Guo

Shanghai University

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010; Xi'an; 16 August 2010 through 19 August 2010

Article number 5582884 648-651

Ämneskategorier

Fysik

DOI

10.1109/ICEPT.2010.5582884

ISBN

978-142448142-2

Mer information

Skapat

2017-10-06