Fabrication and Characterization of Graphene/polyimide Composite Film
Paper i proceeding, 2021

A flexible graphene and polyimide composite film was designed and fabricated in this study. A polyimide solution was used as an adhesive layer to connect graphene film and polyimide film by hot-pressing. Laser flash thermal analysis method was carried out to evaluate the thermal diffusion coefficient of different thicknesses of the fabricated films at various temperatures. Bending test was carried out to evaluate the stability and reliability of the composite film. Scanning electron microscopy was applied to characterize the cross-section of the composite film before and after the peel test. IR imaging was employed to compare the heat diffusion of the composite film and traditional flexible copper clad laminate. The results show that the composite film has significantly better thermal diffusion capacity than traditional flexible copper clad laminate.

Heat diffusion

Cooling

Graphene film

Polyimide

Flexible circuit board

Författare

Xinjian Gong

Shanghai University

Jin Chen

SHT Smart High-Tech

Yong Zhang

Shanghai University

Xiuzhen Lu

Shanghai University

Johan Liu

Shanghai University

Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial

2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021


9780956808677 (ISBN)

23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Virtual, Online, Sweden,

Ämneskategorier

Polymerteknologi

Materialkemi

Kompositmaterial och -teknik

Mer information

Senast uppdaterat

2022-04-05