Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection
Kapitel i bok, 2008

A conductive adhesive is a promising interconnection material for microsystem packaging. The interconnect features are of great importance to system responses under various loading conditions. The flip-chip packaging system with anisotropic conductive film (ACF) joint under thermal loadings has been investigated both experimentally and theoretically. The displacement distributions have been measured by an interferometer, which could provide the in-plane whole-field deformation observation. The interconnection is of much smaller scales compared with the neighbouring components such as the chip and substrate, and there are even finer internal structures involved in the joint. The wide scale range makes both experimental observation and conventional simulation difficult. A micropolar model is thus developed. Utilizing the homogenization, this model requires low computation resource. Combination of this model with a secondorder model was able to produce a highly efficient and valid prediction of the packaging system response under thermal and mechanical loadings. Comparison of the micropolar model simulation and experimental data shows good agreement.

Interconnect

Micropolar model

ACF

Interferometry

Författare

Y. Zhang

Shanghai University

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2)

Shanghai University

Ragnar Larsson

Chalmers, Tillämpad mekanik, Material- och beräkningsmekanik

Itsuo Watanabe

Hitachi Chemical Company, Ltd.

Electrically Conductive Adhesives

411-425

Ämneskategorier

Teknisk mekanik

Energiteknik

Annan elektroteknik och elektronik

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Senast uppdaterat

2019-02-12