Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection
Book chapter, 2008
Interconnect
Micropolar model
ACF
Interferometry
Author
Y. Zhang
Shanghai University
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Shanghai University
Ragnar Larsson
Chalmers, Applied Mechanics, Material and Computational Mechanics
Itsuo Watanabe
Hitachi Chemical Company, Ltd.
Electrically Conductive Adhesives
411-425
Subject Categories
Applied Mechanics
Energy Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering