Experimental investigation and micropolar modelling of the anisotropic conductive adhesive flip-chip interconnection
Book chapter, 2008

A conductive adhesive is a promising interconnection material for microsystem packaging. The interconnect features are of great importance to system responses under various loading conditions. The flip-chip packaging system with anisotropic conductive film (ACF) joint under thermal loadings has been investigated both experimentally and theoretically. The displacement distributions have been measured by an interferometer, which could provide the in-plane whole-field deformation observation. The interconnection is of much smaller scales compared with the neighbouring components such as the chip and substrate, and there are even finer internal structures involved in the joint. The wide scale range makes both experimental observation and conventional simulation difficult. A micropolar model is thus developed. Utilizing the homogenization, this model requires low computation resource. Combination of this model with a secondorder model was able to produce a highly efficient and valid prediction of the packaging system response under thermal and mechanical loadings. Comparison of the micropolar model simulation and experimental data shows good agreement.

Interconnect

Micropolar model

ACF

Interferometry

Author

Y. Zhang

Shanghai University

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Shanghai University

Ragnar Larsson

Chalmers, Applied Mechanics, Material and Computational Mechanics

Itsuo Watanabe

Hitachi Chemical Company, Ltd.

Electrically Conductive Adhesives

411-425

Subject Categories

Applied Mechanics

Energy Engineering

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Latest update

2/12/2019