The effect of functionalized silver on rheological and electrical properties of conductive adhesives
Paper i proceeding, 2011
Författare
Q. Fan
Shanghai University
H. Cui
Shanghai University
C. Fu
Shanghai University
D. Li
Shanghai University
X. Tang
Shanghai University
Z. Yuan
Shanghai University
L. Ye
SHT Smart High-Tech
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
ECS Transactions
19385862 (ISSN) 19386737 (eISSN)
Vol. 34 1 811-816978-160768235-6 (ISBN)
Ämneskategorier
Elektroteknik och elektronik
DOI
10.1149/1.3567678
ISBN
978-160768235-6