The effect of functionalized silver on rheological and electrical properties of conductive adhesives
Paper in proceedings, 2011
Author
Q. Fan
Shanghai University
H. Cui
Shanghai University
C. Fu
Shanghai University
D. Li
Shanghai University
X. Tang
Shanghai University
Z. Yuan
Shanghai University
L. Ye
SHT Smart High-Tech
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems Laboratory
ECS Transactions
1938-5862 (ISSN) 1938-6737 (eISSN)
Vol. 34 1 811-816Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1149/1.3567678
ISBN
978-160768235-6