The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish
Paper i proceeding, 2008

Författare

Lili Zhang

Cristina Andersson

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Proceedings of the 2nd Electronics Systemintegration Technology Conference

1295-1300

Ämneskategorier

Elektroteknik och elektronik

Mer information

Skapat

2017-10-06