The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn–0.7Cu –0.4Co eutectic solder and ENIG/Cu substrate finish
Paper i proceeding, 2008
Författare
Lili Zhang
Cristina Andersson
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
Zhaonian Cheng
Proceedings of the 2nd Electronics Systemintegration Technology Conference
1295-1300
Ämneskategorier
Elektroteknik och elektronik