Highly thermal conductive and light-weight graphene-based heatsink
Paper i proceeding, 2019

With the developing trend of miniaturization and integration of modern electronic devices, commercial heatsinks materials, like copper and aluminum, are facing more and more challenges, such as inefficient cooling performance, large size and heavy weight Here, we solve the problem by developing a novel highly thermal conductive and light-weight graphene heatsink. Composed by vertically-aligned and continuous graphene structures, heat transport was highly efficient from the base to fin structures inside the heatsink The maximum through-plane thermal conductivity of graphene heatsink can be up to 1000 1500 W/mK, which is over 7 times higher than aluminum, and even outperforms copper about 4 times. Graphene heatsink demonstrated outstanding cooling performance which was superior to copper heatsink with the same dimension and same power input. Noticeably, the graphene heatsink also has important advantages of light-weight and high emissivity. The measured density (1.1 g/cm) is only one-eighth of copper and less than half of aluminum and emissivity is about ten times higher than pure copper and aluminum. The resulting graphene heatsink thus opens new opportunities for addressing large heat dissipation issues in weight driven electronics and other high power systems.

Cooling

Graphene

Thermal conductivity

Heatsink

Författare

Nan Wang

SHT Smart High-Tech

Ya Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019

8951839

22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
Pisa, Italy,

Ämneskategorier

Energiteknik

Annan fysik

Annan elektroteknik och elektronik

DOI

10.23919/EMPC44848.2019.8951839

Mer information

Senast uppdaterat

2020-03-30