Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles
Artikel i vetenskaplig tidskrift, 2019

SiC microparticles with various weight ratios (0.0, 0.5, 1.0 and 1.5 wt%) are incorporated into sintered silver nanoparticles (AgNP) as one of the promising packaging materials for high-power electronic devices. Mechanical properties and constitutive behaviour of sintered AgNP reinforced by SiC microparticles are investigated based on nanoindentation experiment and analytical approach. Nanoindentations were performed in the manner of continuous stiffness measurement for a maximum penetration depth of 2000 nm at a strain rate of 0.05 s−1. Particularly, a Berkovich indenter is utilized to evaluate the values of Young's modulus and hardness, and a spherical indenter is utilized to describe the constitutive behaviour. For sintered AgNP with 0.5 wt% SiC, the morphology exhibits uniformly compact microstructures to enable optimizing the heat conductivity, the yield strength and hardening capacity of sintered AgNP material is enhanced. To describe the constitutive behaviour, an analytical approach is proposed to simulate the indentation behaviour. The parameters in the modified power-law model are determined by fitting the average indentation responses. The developed correlation between microstructure and macroscopic properties facilitates the design of AgNP paste morphology and improves the mechanical properties of sintered AgNP in electronics packaging.

Mechanical property

Constitutive behaviour


SiC microparticle

Sintered silver nanoparticle


Xu Long

Northwestern Polytechnical University

Zhen Li

Northwestern Polytechnical University

Xiuzhen Lu

Shanghai University

Hongcun Guo

Northwestern Polytechnical University

Chao Chang

Taiyuan University of Science and Technology

Qianran Zhang

Shanghai University

Abdelhafid Zehri

SHT Smart High-Tech

W. Ke

Shanghai University

Yao Yao

Northwestern Polytechnical University

Lilei Ye

SHT Smart High-Tech

Johan Liu

Shanghai University

Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial

Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

0921-5093 (ISSN)

Vol. 744 406-414


Teknisk mekanik


Kompositmaterial och -teknik



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