Mechanical behaviour of sintered silver nanoparticles reinforced by SiC microparticles
Artikel i vetenskaplig tidskrift, 2019

SiC microparticles with various weight ratios (0.0, 0.5, 1.0 and 1.5 wt%) are incorporated into sintered silver nanoparticles (AgNP) as one of the promising packaging materials for high-power electronic devices. Mechanical properties and constitutive behaviour of sintered AgNP reinforced by SiC microparticles are investigated based on nanoindentation experiment and analytical approach. Nanoindentations were performed in the manner of continuous stiffness measurement for a maximum penetration depth of 2000 nm at a strain rate of 0.05 s−1. Particularly, a Berkovich indenter is utilized to evaluate the values of Young's modulus and hardness, and a spherical indenter is utilized to describe the constitutive behaviour. For sintered AgNP with 0.5 wt% SiC, the morphology exhibits uniformly compact microstructures to enable optimizing the heat conductivity, the yield strength and hardening capacity of sintered AgNP material is enhanced. To describe the constitutive behaviour, an analytical approach is proposed to simulate the indentation behaviour. The parameters in the modified power-law model are determined by fitting the average indentation responses. The developed correlation between microstructure and macroscopic properties facilitates the design of AgNP paste morphology and improves the mechanical properties of sintered AgNP in electronics packaging.

Mechanical property

Constitutive behaviour

Nanoindentation

SiC microparticle

Sintered silver nanoparticle

Författare

[Person e60c824b-4ba7-4bb1-8c8b-b7a71242a571 not found]

Northwestern Polytechnical University

[Person 9a4cf0d8-8588-4319-ad4e-06e76da8f9cf not found]

Northwestern Polytechnical University

[Person f2318692-85d0-4e65-8092-085b0b0c4c0f not found]

Shanghai University

[Person 91056444-4b0c-4013-8231-8ac8ba77e0e2 not found]

Northwestern Polytechnical University

[Person c7812c32-e45a-4e41-9a09-9cfb2b3d027a not found]

Taiyuan University of Science and Technology

[Person 858383d1-4708-4135-9b0e-4180235cb821 not found]

Shanghai University

[Person 51b8ce92-67c7-4fcb-9ad6-561a5086342d not found]

SHT Smart High-Tech

[Person 9986118a-c629-4489-94d2-13637cd08a67 not found]

Shanghai University

[Person 96653be0-f3ca-430d-aca8-b40f79c33197 not found]

Northwestern Polytechnical University

[Person dfe14767-a7b5-46f5-9c1e-b76914de1fd7 not found]

SHT Smart High-Tech

[Person becce727-9c07-4285-8487-ae55b6538016 not found]

Shanghai University

Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial

Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing

0921-5093 (ISSN)

Vol. 744 406-414

Ämneskategorier

Teknisk mekanik

Keramteknik

Kompositmaterial och -teknik

DOI

10.1016/j.msea.2018.12.015

Mer information

Senast uppdaterat

2019-01-25