Influence of substrate on electrical conductivity of isotropic conductive adhesive
Paper i proceeding, 2011

Isotropic conductive adhesive (ICA) is widely used with different kinds of substrates in electronics packaging applications. Therefore it is necessary to understand the influence of electrical conductivity of ICA from substrate. In this work, we investigated the electrical resistivity of ICA on quartz, PCB and glass substrate. The experimental data showed that the in-plane electrical conductivity of ICA on PCB is almost twice that of the glass substrate, while the conductivity of ICA on quartz is also significantly greater than that of glass, under the same curing temperature and with the same bond line thickness (BLT) of ICA. This paper later concludes that thermal conductive adhesive (TCA) on substrate with higher thermal expansion coefficient (CTE) is likely to give better performance. Finally, Finite Element Modeling (FEM) and analysis shows that this phenomenon could be universal to ICA and TCA.

Författare

Zhili Hu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Wenhui Du

Shanghai University

Cong Yue

Shanghai University

Lilei Ye

SMIT Ltd. Co.

Zhichao Yuan

SMIT Ltd. Co.

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Proceedings of the IEEE International Symposium on Advanced Packaging Materials (APM), Xiamen, China, October 25-28, 2011

1550-5723 (ISSN)

330 - 335

Styrkeområden

Produktion

Ämneskategorier

Elektroteknik och elektronik

DOI

10.1109/ISAPM.2011.6105732

ISBN

978-1-4673-0148-0

Mer information

Skapat

2017-10-07