Critical atomic-level processing technologies: Remote plasma-enhanced atomic layer deposition and atomic layer etching
Reviewartikel, 2018

As feature sizes of devices shrink every year, deposition and etching processes change to be very challenge, especially for sub-7 nm technology node. The acceptable variability of feature size is expected to be several atoms of silicon/germanium in the future. Therefore, Remote Plasma-Enhanced Atomic Layer Deposition (RPE-ALD) and Atomic Layer Etching (ALE) change to be more and more important in the semiconductor fabrication. Due to their self-limiting behavior, the atomic-scale fidelity could be realized for both of them in the processes. Compared with traditional Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) methods, atomic-scale thickness controllability and good conformality can be achieved by RPE-ALD. Unlike conventional plasma etching, atomicscale precision and excellent depth uniformity can be achieved by ALE. The fundamentals and applications of RPE-ALD and ALE have been discussed in this paper. Using the combination of them, atomic-level deposition/etch-back method is also mentioned for achieving high quality ultra-thin films on three dimensional (3D) features.

Atomic layer etching

Selflimiting behavior

Ultra-large scale integration system

Low deposition temperature

Plasma-enhanced atomic layer deposition

Atomic-level deposition/etch-back method


G. Yuan

Shanghai University

Haohao Li

Shanghai University

B. Shan

Shanghai University

Johan Liu

Shanghai University

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Micro and Nanosystems

1876-4029 (ISSN) 1876-4037 (eISSN)

Vol. 10 2 76-83


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