Thermal chemical vapor deposition grown graphene heat spreader for thermal management of hot spots
Artikel i vetenskaplig tidskrift, 2013

Graphene of different layer numbers was fabricated using thermal chemical vapor deposition (TCVD), and it was demonstrated as a heat spreader in electronic packaging. Platinum thermal evaluation chips were used to evaluate the thermal performance of the graphene heat spreaders. The temperature of a hot spot driven at a heat flux of up to 430 W cm(-2) was decreased from 121 degrees C to 108 degrees C (Delta T approximate to 13 degrees C) with the insertion of the monolayer graphene heat spreader, compared with the multilayer (n = 6-10) ones' temperature drop of similar to 8 degrees C. Various parameters affecting the thermal performance of graphene heat spreaders were discussed, e.g. layer numbers of graphene, phonon scattering, thermal boundary resistance. We demonstrate the potentials of using a complementary metal oxide semiconductor compatible TCVD process to utilize graphene as a heat spreader for heat dissipation purposes.

monolayer graphene

single-crystal graphene

copper

foils

stacked bilayer graphene

films

ultrathin graphite

large-area

high-quality

conductivity

few-layer graphene

Författare

Zhaoli Gao

Chalmers, Mikroteknologi och nanovetenskap (MC2)

Yong Zhang

Chalmers, Teknisk fysik, Elektronikmaterial och system

Y. F. Fu

SHT Smart High-Tech

Matthew Yuen

Hong Kong University of Science and Technology

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial och system

Carbon

0008-6223 (ISSN)

Vol. 61 342-348

Ämneskategorier

Den kondenserade materiens fysik

DOI

10.1016/j.carbon.2013.05.014

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Senast uppdaterat

2018-03-07