Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and annealing
Paper i proceeding, 2012

Författare

Masahiro Inoue

Hiroaki Muta

Shinsuke Yamanaka

Johan Liu

Chalmers, Teknisk fysik, Elektronikmaterial och system

CD Proceedings of the 4th Electronics System Integration Technologies Conference (ESTC 2012)

27-

Ämneskategorier

Annan elektroteknik och elektronik

Mer information

Skapat

2017-10-06