Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and annealing
Paper i proceeding, 2012
Författare
Masahiro Inoue
Hiroaki Muta
Shinsuke Yamanaka
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
CD Proceedings of the 4th Electronics System Integration Technologies Conference (ESTC 2012)
27-
Ämneskategorier
Annan elektroteknik och elektronik
DOI
10.1109/ESTC.2012.6542146