Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and annealing
Paper in proceedings, 2012

Author

Masahiro Inoue

Hiroaki Muta

Shinsuke Yamanaka

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

CD Proceedings of the 4th Electronics System Integration Technologies Conference (ESTC 2012)

27-

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017