Microstructural evolution in electrically conductive adhesives containing Ag micro-fillers during curing and annealing
Paper in proceeding, 2012
Author
Masahiro Inoue
Hiroaki Muta
Shinsuke Yamanaka
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
CD Proceedings of the 4th Electronics System Integration Technologies Conference (ESTC 2012)
27-
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/ESTC.2012.6542146