Novel nanostructured thermal interface materials: a review
Reviewartikel, 2018
The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.
Thermal interface materials
thermal management
Författare
Josef Hansson
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
Torbjörn M. J. Nilsson
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
L. Ye
SHT Smart High-Tech
Johan Liu
Shanghai University
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
International Materials Reviews
0950-6608 (ISSN) 17432804 (eISSN)
Vol. 63 1 22-45Ämneskategorier
Materialteknik
Styrkeområden
Produktion
DOI
10.1080/09506608.2017.1301014