Novel nanostructured thermal interface materials: a review
Artikel i vetenskaplig tidskrift, 2018

The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.

Thermal interface materials

thermal management

Författare

Josef Hansson

Elektronikmaterial och system

Torbjörn M. J. Nilsson

Elektronikmaterial och system

L. Ye

Johan Liu

Elektronikmaterial och system

International Materials Reviews

0950-6608 (ISSN)

Vol. 63 1 22-45

Ämneskategorier

Materialteknik

Styrkeområden

Produktion

DOI

10.1080/09506608.2017.1301014