Novel nanostructured thermal interface materials: a review
Journal article, 2018

The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.

thermal management

Thermal interface materials

Author

Josef Hansson

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Torbjörn M. J. Nilsson

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

L. Ye

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

International Materials Reviews

0950-6608 (ISSN)

Vol. 63 1 22-45

Subject Categories

Materials Engineering

Areas of Advance

Production

DOI

10.1080/09506608.2017.1301014

More information

Latest update

9/21/2018