Novel nanostructured thermal interface materials: a review
Review article, 2018
The trend of continuing miniaturisation of microelectronics leads to new thermal management challenges. A key point in the heat removal process development is to improve the heat conduction across interfaces through improved thermal interface materials (TIMs). We identify the key areas for state-of-the art TIM research and investigate the current state of the field together with possible future advances.
Thermal interface materials
thermal management
Author
Josef Hansson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Torbjörn M. J. Nilsson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
L. Ye
SHT Smart High-Tech
Johan Liu
Shanghai University
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
International Materials Reviews
0950-6608 (ISSN) 17432804 (eISSN)
Vol. 63 1 22-45Subject Categories
Materials Engineering
Areas of Advance
Production
DOI
10.1080/09506608.2017.1301014