Josef Hansson

Doktorand vid Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Visar 10 publikationer

2019

Reliability investigation of a carbon nanotube array thermal interface material

Andreas Nylander, Josef Hansson, Majid Kabiri Samani et al
Energies. Vol. 12 (11)
Artikel i vetenskaplig tidskrift
2019

Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material

Josef Hansson, Torbjörn Nilsson, L. Ye et al
IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 9 (6), p. 1045-1053
Artikel i vetenskaplig tidskrift
2018

Novel nanostructured thermal interface materials: a review

Josef Hansson, Torbjörn M. J. Nilsson, L. Ye et al
International Materials Reviews. Vol. 63 (1), p. 22-45
Artikel i vetenskaplig tidskrift
2018

Solder Matrix Fiber Composite Thermal Interface Materials

Josef Hansson
Licentiatavhandling
2017

Fabrication and characterization of a carbon fiber solder composite thermal interface material

Josef Hansson, L. Ye, Johan Liu
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 97-100
Paper i proceeding
2017

Finite element analysis of bond line thickness and fiber distribution in solder based thermal interface materials

Maulik Satwara, Josef Hansson, L. Ye et al
2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Goteborg, Sweden, 18-20 June 2017, p. 167-171
Paper i proceeding
2016

A review of recent progress of thermal interface materials: from research to industrial applications

Josef Hansson, Liley Ye, Henric Rhedin et al
IMAPS Nordic Annual Conference 2016 Proceedings; Tonsberg; Norway; 5 - 7 June 2016
Paper i proceeding
2016

Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications

Josef Hansson, Carl Zandén, L. Ye et al
2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano), p. 371-374
Paper i proceeding
2016

Double-Densified VerticallyAligned Carbon Nanotube Bundles for Application in 3D Integration High Aspect Ratio TSV Interconnects

Wei Mu, Josef Hansson, Shuangxi Sun et al
66th IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, USA, May 31-Jun 03, 2016, p. 211-216
Paper i proceeding
2016

Graphene Fibres: Towards high mechanical, thermal and electrical properties state of art

Abdelhafid Zehri, Josef Hansson, Lilei Ye et al
IMAPS Nordic Annual Conference 2016, Tonsberg, Norway, 5-7 June 2016
Paper i proceeding

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