Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications
Paper i proceeding, 2016

Increasing power densities within microelectronic systems place an ever increasing demand on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at the interface between two materials, greatly increasing the thermal conductance when solid surface are attached together. The last decade has provided significant development on high-performing TIMs, and this paper makes a summarized review on recent progress on the topic. Current state of the art commercial TIM types are presented, and discussed in regards to their advantages and disadvantages. Two main categories of TIMs with high interest are then reviewed: continuous metal phase TIMs and carbon nanotube array TIMs.

Science & Technology - Other Topics

performance

solder

carbon nanotube arrays

CROSTRUCTURE AND PROCESSING3rd International Conference on Materials for Advanced

conduction

films

gallium

matrix composite

Författare

Josef Hansson

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

Carl Zandén

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fotonik

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano)

371-374

Styrkeområden

Nanovetenskap och nanoteknik

Ämneskategorier

Elektroteknik och elektronik

Nanoteknik

DOI

10.1109/NANO.2016.7751383

ISBN

978-1-5090-1493-4