Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications
Paper i proceeding, 2016

Increasing power densities within microelectronic systems place an ever increasing demand on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at the interface between two materials, greatly increasing the thermal conductance when solid surface are attached together. The last decade has provided significant development on high-performing TIMs, and this paper makes a summarized review on recent progress on the topic. Current state of the art commercial TIM types are presented, and discussed in regards to their advantages and disadvantages. Two main categories of TIMs with high interest are then reviewed: continuous metal phase TIMs and carbon nanotube array TIMs.

carbon nanotube arrays

matrix composite

conduction

Science & Technology - Other Topics

films

solder

gallium

performance

CROSTRUCTURE AND PROCESSING3rd International Conference on Materials for Advanced

Författare

Josef Hansson

Elektronikmaterial och system

Carl Zandén

Elektronikmaterial och system

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fotonik

Elektronikmaterial och system

2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano)

371-374

Styrkeområden

Nanovetenskap och nanoteknik

Ämneskategorier

Elektroteknik och elektronik

Nanoteknik

DOI

10.1109/NANO.2016.7751383

ISBN

978-1-5090-1493-4