Review of Current Progress of Thermal Interface Materials for Electronics Thermal Management Applications
Paper in proceedings, 2016

Increasing power densities within microelectronic systems place an ever increasing demand on the thermal management. Thermal interface materials (TIMs) are used to fill air gaps at the interface between two materials, greatly increasing the thermal conductance when solid surface are attached together. The last decade has provided significant development on high-performing TIMs, and this paper makes a summarized review on recent progress on the topic. Current state of the art commercial TIM types are presented, and discussed in regards to their advantages and disadvantages. Two main categories of TIMs with high interest are then reviewed: continuous metal phase TIMs and carbon nanotube array TIMs.

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CROSTRUCTURE AND PROCESSING3rd International Conference on Materials for Advanced

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Author

Josef Hansson

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Carl Zandén

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Photonics

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

2016 Ieee 16th International Conference on Nanotechnology (Ieee-Nano)

371-374

Areas of Advance

Nanoscience and Nanotechnology (2010-2017)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

Nano Technology

DOI

10.1109/NANO.2016.7751383

ISBN

978-1-5090-1493-4

More information

Latest update

9/21/2018