Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application
Paper i proceeding, 2014

The results of investigations of new compositions of electrically conductive adhesives (ECA) for printed electronics applications with and without nano-additives are presented. The studies covered the influence of nano additives on mechanical properties and reliability of interconnects made by elaborated, improved composition of the ECA based on primary conclusions. The obtained results showed that nano additives influence significantly and positively on mechanical properties of ECA joints, but their impact on the reliability properties of joints manufactured in low temperatures is much lower or even negative.

reliability of interconnects

Electrically conductive adhesives

mechanical properties

printed electronics

nano additives

Författare

J. Sitek

Instytut Tele-i Radiotechniczny, Warszawa

M. Koscielski

Instytut Tele-i Radiotechniczny, Warszawa

Y. Zhang

Shanghai University

J. Fan

Shanghai University

S. Ma

Shanghai University

Johan Liu

Chalmers, Mikroteknologi och nanovetenskap (MC2), Elektronikmaterial och system

15th International Conference on Electronic Packaging Technology, ICEPT 2014; Wangjiang HotelChengdu; China; 12 August 2014 through 15 August 2014

151-154

Ämneskategorier

Elektroteknik och elektronik

DOI

10.1109/ICEPT.2014.6922625

ISBN

978-147994707-2