Experimental measurements for mechanical and electrical conductive properties of CNT bundles
Paper i proceeding, 2013
Mechanical behavior
Carbon nanotubes
Mechanical and electrical
Consumer electronics
Heat flux
Heat flux densities
Silicon chip
Electrical conductivity
Characteristic size
Yarn
Conductive properties
Carbon
Flip chip interconnects
Författare
Y. Zhang
Shanghai University
Yingjie Zhou
Shanghai University
Jing-yu Fan
Shanghai University
Johan Liu
Chalmers, Teknisk fysik, Elektronikmaterial
6th International Conference on Nonlinear Mechanics, ICNM 2013; Shanghai; China; 12 August 2013 through 15 August 2013
454-457
9781605951096 (ISBN)
Ämneskategorier
Nanoteknik
Bioinformatik och systembiologi
ISBN
9781605951096