Characterterization of multi-scale nanosilver paste reinforced with SIC particles
Paper i proceeding, 2020
Författare
Ziwei Jiang
Shanghai University
Yongqian Sun
Shanghai University
Qiaoran Zhang
Shanghai University
Zhen Lv
Shanghai University
Yanpei Wu
Aerospace Science and Technology Corporation
Weijuan Xi
Aerospace Science and Technology Corporation
Cheng Zhou
Aerospace Science and Technology Corporation
S. Chen
Shanghai University
Maomao Zhang
Shanghai University
Johan Liu
Shanghai University
Chalmers, Mikroteknologi och nanovetenskap, Elektronikmaterial
Xiuzhen Lu
Shanghai University
China Semiconductor Technology International Conference 2020, CSTIC 2020
9282590
9781728165585 (ISBN)
Shanghai, China,
Ämneskategorier
Tribologi
Keramteknik
Bearbetnings-, yt- och fogningsteknik
DOI
10.1109/CSTIC49141.2020.9282590