Characterterization of multi-scale nanosilver paste reinforced with SIC particles
Paper in proceeding, 2020

Nanosilver paste with high operation temperature and low sintering temperature has attracted more and more attention for its promising application in high power devices. In this paper, the thermal properties of multi-scale nanosilver paste composed of nanometer and micrometer silver particles, and Ag-coated SiC particles were investigated. The thermal conductivity of multi-scale nanosilver paste increases with the increasing amount of SiC particles with Ag coating. The maximum value of Vickers hardness for multi-scale nanosilver paste with 0.5 wt.% Ag-coated SiC particles were 24.


Ziwei Jiang

Shanghai University

Yongqian Sun

Shanghai University

Qiaoran Zhang

Shanghai University

Zhen Lv

Shanghai University

Yanpei Wu

Aerospace Science and Technology Corporation

Weijuan Xi

Aerospace Science and Technology Corporation

Cheng Zhou

Aerospace Science and Technology Corporation

S. Chen

Shanghai University

Maomao Zhang

Shanghai University

Johan Liu

Shanghai University

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Xiuzhen Lu

Shanghai University

China Semiconductor Technology International Conference 2020, CSTIC 2020

9781728165585 (ISBN)

2020 China Semiconductor Technology International Conference, CSTIC 2020
Shanghai, China,

Subject Categories



Manufacturing, Surface and Joining Technology



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