Characterterization of multi-scale nanosilver paste reinforced with SIC particles
Paper in proceeding, 2020
Nanosilver paste with high operation temperature and low sintering temperature has attracted more and more attention for its promising application in high power devices. In this paper, the thermal properties of multi-scale nanosilver paste composed of nanometer and micrometer silver particles, and Ag-coated SiC particles were investigated. The thermal conductivity of multi-scale nanosilver paste increases with the increasing amount of SiC particles with Ag coating. The maximum value of Vickers hardness for multi-scale nanosilver paste with 0.5 wt.% Ag-coated SiC particles were 24.
Author
Ziwei Jiang
Shanghai University
Yongqian Sun
Shanghai University
Qiaoran Zhang
Shanghai University
Zhen Lv
Shanghai University
Yanpei Wu
Aerospace Science and Technology Corporation
Weijuan Xi
Aerospace Science and Technology Corporation
Cheng Zhou
Aerospace Science and Technology Corporation
S. Chen
Shanghai University
Maomao Zhang
Shanghai University
Johan Liu
Shanghai University
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Xiuzhen Lu
Shanghai University
China Semiconductor Technology International Conference 2020, CSTIC 2020
9282590
9781728165585 (ISBN)
2020 China Semiconductor Technology International Conference, CSTIC 2020
Shanghai, China,
Shanghai, China,
Subject Categories
Tribology
Ceramics
Manufacturing, Surface and Joining Technology
DOI
10.1109/CSTIC49141.2020.9282590