Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty
Paper i proceeding, 2006
Författare
Cristina Andersson
Chalmers, Mikroteknologi och nanovetenskap, Fasta tillståndets elektronik
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China
Ämneskategorier
Annan materialteknik