Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty
Paper in proceeding, 2006
Author
Cristina Andersson
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China
Subject Categories
Other Materials Engineering