Effect of different temperature cycle profiles on the crack initiation and propagation of Sn3,5Ag wave soldered joints
Journal article, 2008

Author

Cristina Andersson

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Dag R. Andersson

Per-Erik Tegehall

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Microelectronics Reliability

Vol. 47 266-272

Subject Categories

Other Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017