Effect of different temperature cycle profiles on the crack initiation and propagation of Sn3,5Ag wave soldered joints
Journal article, 2008
Author
Cristina Andersson
Chalmers, Applied Physics, Electronics Material and Systems
Dag R. Andersson
Per-Erik Tegehall
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Microelectronics Reliability
Vol. 47 266-272
Subject Categories
Other Electrical Engineering, Electronic Engineering, Information Engineering